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An innovative embedded chip MCM technology is being developed to address the packaging needs of the high volume, non‐military electronics industries. This development has evolved out of the GE High Density Interconnect (HDI) embedded chip MCM technology that was aimed at very high performance electronics in harsh military environments. In the HDI process, multiple bare chips are placed into cavities formed in a ceramic substrate and interconnected using an overlay polymer film, thin film metallisation and laser formed vias. Multiple levels of fine line (20 to 40 microns) interconnections and reference planes are used to form the circuit. In this new process, a plastic encapsulated substrate is formed by moulding a polymer resin around the bare die after placement on to a flat polymer film pre‐coated with an adhesive layer. After curing of the resin, the circuit is formed by patterning via holes through the polymer film to the components, metallising the polymer film and patterning the metal into the desired interconnect pattern. Feature sizes are readily scaled to the complexity needed by the circuit, permitting the use of lower cost and higher yield board photopatterning processes and equipment. This paper will cover the development of this low cost technology and will describe the process. It will also describe the thermal, mechanical and electrical features of this process and show actual working prototype modules.

A package performance bottleneck is developing because of the inability to densely wire single chip modules together on the printed wiring board. An array processor, constructed by means of various high performance packaging techniques, demonstrates that multichip modules of even modest size can give dramatic improvements in the packaging figure of merit.

A review of state‐of‐the‐art technology pertinent to tape automated bonding (for fine pitch, high I/O, high performance, high yield, high volume and high reliability) is presented. Emphasis is placed on a new understanding of the key elements (for example, tapes, bumps, inner lead bonding, testing and burn‐in on tape‐with‐chip, encapsulation, outer lead bonding, thermal management, reliability and rework) of this rapidly moving technology.

The purpose of this paper is to understand the role played by accounting in managing an early nineteenth century lunatic asylum in Palermo, Italy.

The paper is informed by Foucault’s studies of lunatic asylums and his work on governmentality which gave prominence to the role of statistics, the “science of the State”.

This paper identifies a number of roles played by accounting in the management of the lunatic asylum studied. Most importantly, information which formed the basis of accounting reports was used to describe, classify and give visibility and measurability to the “deviance” of the insane. It also legitimated the role played by lunatic asylums, as entrusted to them in post-Napoleonic early nineteenth century society, and was a tool to mediate with the public authorities to provide adequate resources for the institution to operate.

This paper encourages accounting scholars to engage more widely with socio-historical research that will encompass organisations such as lunatic asylums.

This paper provides, for the first time, a case of accounting applied to a lunatic asylum from a socio-historical perspective.

Process models are a valuable tool in the design and configuration of enterprises. However, current modeling techniques have shortcomings that prevent them from fully supporting the analysis required to design an enterprise. This is especially true when considering the needs of modeling highly distributed and temporary multi‐company enterprises such as fractal or virtual enterprises. This paper presents a modeling scheme that supports a process‐centered approach to the analysis and design of both conventional and extended enterprises. Using a holon‐based approach to model the components of an enterprise, it allows for the development of integrated business rule, activity, resource, business process, and organizational views of the enterprise using the IDEF suite of modeling methods. The scheme is built around a central IDEF5 model of the enterprise from which the other views are extracted. The paper also describes the technique for developing an enterprise model using the scheme.

This paper aims to quantify the impact of antecedents (frustration, locus of control, spirituality, and religion and attention to social-comparison information) on the intensity of emotional outcomes of consumers’ disposal behaviour.

A structural equation model fitted with PLS was used to evaluate data obtained from 323 self-administered questionnaires filled out in a stratified random sample of respondents living in Gaza Strip camps.

Spirituality and religion, and attention to social-comparison information have the highest impacts on emotional outcomes related to consumer disposal behaviour.

Spirituality and religion are seldom considered in previous consumer research, but they turn out to have high relevance for disposal-related emotions.

To the best of the authors’ knowledge, this is the first study investigating disposal-related emotions. Moreover, it is also the first study combining the impact of frustration, locus of control, perceived self-efficacy, spirituality and religion and attention to social-comparison information on emotional outcomes related to consumers’ disposal behaviour.

The explosive growth of high‐density packaging has created a tremendous impact on the electronics assembly and manufacturing industry. Ball Grid Array (BGA), Chip Scale Packaging (CSP), Direct Chip Attach (DCA), and flip‐chip technologies are taking the lead in this advanced manufacturing process. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. In this paper, they will be briefly discussed.

Real-time location sensing (RTLS) systems offer a significant potential to advance the management of construction processes by potentially providing real-time access to the locations of workers and equipment. Many location-sensing technologies tend to perform poorly for indoor work environments and generate large data sets that are somewhat difficult to process in a meaningful way. Unfortunately, little is still known regarding the practical benefits of converting raw worker tracking data into meaningful information about construction project progress, effectively impeding widespread adoption in construction.

The presented framework is designed to automate as many steps as possible, aiming to avoid manual procedures that significantly increase the time between progress estimation updates. The authors apply simple location tracking sensor data that does not require personal handling, to ensure continuous data acquisition. They use a generic and non-site-specific knowledge base (KB) created through domain expert interviews. The sensor data and KB are analyzed in an abductive reasoning framework implemented in Answer Set Programming (extended to support spatial and temporal reasoning), a logic programming paradigm developed within the artificial intelligence domain.

This work demonstrates how abductive reasoning can be applied to automatically generate rich and qualitative information about activities that have been carried out on a construction site. These activities are subsequently used for reasoning about the progress of the construction project. Our framework delivers an upper bound on project progress (“optimistic estimates”) within a practical amount of time, in the order of seconds. The target user group is construction management by providing project planning decision support.

The KB developed for this early-stage research does not encapsulate an exhaustive body of domain expert knowledge. Instead, it consists of excerpts of activities in the analyzed construction site. The KB is developed to be non-site-specific, but it is not validated as the performed experiments were carried out on one single construction site.

The presented work enables automated processing of simple location tracking sensor data, which provides construction management with detailed insight into construction site progress without performing labor-intensive procedures common nowadays.

While automated progress estimation and activity recognition in construction have been studied for some time, the authors approach it differently. Instead of expensive equipment, manually acquired, information-rich sensor data, the authors apply simple data, domain knowledge and a logical reasoning system for which the results are promising.

The purpose of this paper is to survey the treatment of relationships, relationship expressions and the ways in which they manifest themselves in image descriptions.

The term “relationship” is construed in the broadest possible way to include spatial relationships (“to the right of”), temporal (“in 1936,” “at noon”), meronymic (“part of”), and attributive (“has color,” “has dimension”). The intentions of these vaguely delimited categories with image information, image creation, and description in libraries and archives is complex and in need of explanation.

The review brings into question many generally held beliefs about the relationship problem such as the belief that the semantics of relationships are somehow embedded in the relationship term itself and that image search and retrieval solutions can be found through refinement of word-matching systems.

This review has no hope of systematically examining all evidence in all disciplines pertaining to this topic. It instead focusses on a general description of a theoretical treatment in Library and Information Science.

A new solder‐bumped flip chip land grid array (LGA) chip scale package (CSP) called NuCSP is presented in this paper. NuCSP is a minimized body size package with a rigid substrate (interposer). The design concept is to utilize the interposer to redistribute the very fine pitch peripheral pads on the solder‐bumped chip to much larger pitch area‐array pads on the printed circuit board (PCB). Using conventional PCB substrate manufacturing processes, NuCSP offers a very low‐cost package suitable for memory chips and low pin‐count application‐specific ICs (ASICs). Also, NuCSP is surface mount technology (SMT) compatible and can be joined to the PCB with a 6‐mil (0.15mm) thick 63wt %Sn‐37% Pb solder paste.